Cool Analysis
Cool analysis helps to optimize the cooling circuit design of the mold to achieve uniform mold cooling and achieve minimum cycle time.Non-uniform temperature distribution can lead to warpage and related part quality problems.Cooling analysis determines the temperature distribution on the cavity and core for the given process condition. Based on this suitable modifications to the mold design can be derived.Choices of providing inserts made of materials with higher heat extraction capability in areas of hot spots in the mold can be evaluated using the cooling analysis.Ultimately the optimization of mold design using cooling analysis to minimize the cycle time has the benefit of yielding greater productivity.
In cool analysis we can observe & analyze the temperature distribution in the cooling circuit and physically model the Baffles & Bubblers in the cooling circuit. A Detailed study & setting up of loading parameters is possible for a widely ranging circuit specification. Based on results obtained, we are able to plan the circuit, localized cooling, Flow rates, Input & Output temperatures to ensure the best cooling results
Cool analysis facilitates
- Optimum Cooling circuit design.
- Location of hot spots.
- Better core/cavity temperature setup.
- Evaluation of Cooling efficiency in core and cavity side.
- Optimization of cooling time required.